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Wednesday, 21st February 2007 (7947 views)

A leading gold bonding wire supplier, Tanaka Denshi Kogyo, has announced that a link up with insulation for bonding wires inventor, Microbonds, is set to take place for a new technological breakthrough.

X-Wire is set to become available during the midway point of the first quarter this year and it offers an interconnect solution that relies on proprietary insulation being added to bare bonding wires.

In layman's terms, this new product will enable people to bring interconnect bonding wires into contact with each other without shorting the circuit.

John Scott, CEO of Microbonds, said: "We are pleased to have met our objective of having Tanaka Denshi be production capable for X-Wire production from its Saga, Japan, facilities as scheduled."

The X-Wire start-up kit consists of two spools of gold wire, process characterisation tools, instructions and a modification kit.

By using X-Wire, customers will be able to solve yield losses which are caused by wire sweep, as well as saving money due to the direct ball bonding and the thinner wires used with the product.

 

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