Tuesday, 15th March 2005 (2688 views)

Gold is to be used to help US scientists find a safe alternative to the lead solder which holds computer components together.

The solder in old computers, cell phones and other electronic devices is an environmental problem for manufacturers and it has already been banned in Japan, with a European banned set for 2006.

According to UPI, scientists from the Georgia Institute of Technology in Atlanta are trying to develop an electricity conducting glue.

The glue contains self-assembled monolayers, like tiny wires, of thiols, sulphur containing conductive materials.

These wires then bind directly with gold in various components to address conductivity problems.

Replacing lead has proved a problem for scientists since the material needs to not only hold items in place but also conduct electricity efficiently.

The research was displayed at the national meeting of the American Chemical Society in San Diego and claims that using an adhesive will cut the complexity of manufacturing and the heat stress of melting solders.

 

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